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Advanced Packaging Integration Expert - D2W / CMOS

Job description

Role Overview

Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ULP CMOS platforms. The role spans from early-stage process development through to manufacturing transfer.

Key Responsibilities

  • Develop and optimize process flows and recipes for defect-free, high-reliability manufacturing

  • Lead integration of new advanced packaging features on FINFET and FDSOI platforms

  • Coordinate device testing and ensure robust inspection & control methodologies

  • Analyze performance, reliability, and defect data to drive improvements

  • Freeze qualified processes and support production ramp-up

  • Cross-functional collaboration and occasional reporting to internal/external stakeholders

  • Ensure compliance with EHS&S requirements

Ideal Requirements

  • B.S. in EE, Materials Science, or related field (M.S./Ph.D. preferred)

  • 8-12+ years' experience in advanced packaging, integration, R&D, NPI, or module development

  • Strong in DOE, lot handling, data analysis (inline/HOL/ET)

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

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