Deputy Director of Litho Process (Back-End Semicon)

Role Overview
Lead the process engineering function for bumping fabrication, ensuring operational stability, yield optimization, technology advancement, and team development in wafer-level packaging processes.

Key Responsibilities:

• Lead and manage multi-section process engineering teams across photolithography, PVD, plating, etch/clean, reflow, AOI, and metrology.

• Oversee daily fab performance; drive yield, quality, cycle time, and cost improvements.

• Direct NPI, technology transfers, and process integration initiatives.

• Implement robust process control systems (SPC, DOE, FMEA, OCAP, FDC) and promote digital/process analytics.

• Mentor and develop engineers and section managers; foster high-performance team culture.

• Ensure adherence to EHS, quality, ISO standards, and participate in audits.

• Collaborate cross-functionally with Manufacturing, Planning, Quality, IT/Automation, and customers.

Ideal Requirements:

• Bachelor's or Master's degree in Engineering (Microelectronics, Materials, Chemical, Electrical, or related).

• 12-18 years semiconductor process experience, with ≥5 years in managerial/senior leadership roles.

• Strong expertise in wafer bumping/WLP processes (UBM, RDL, Cu pillar, solder bump, WLCSP).

• Proven success in yield improvement, technology transfer, and cost optimization.

• Familiarity with major fab equipment (TEL, ASML, EVG, DISCO, SUSS).

• Skilled in SPC, DOE, FMEA, data analytics, and process integration.

• Strategic thinker with strong leadership, communication, and stakeholder management skills.

• Ability to thrive in fast-paced, high-mix manufacturing environments.

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614