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Etch Process Engineer - Advanced Packaging

Job description

Role Overview

Seeking a skilled Process Engineer to develop, optimize, and sustain advanced packaging etch processes (e.g. TSV, plasma dicing, bonding) in a 300mm manufacturing environment. The role involves hands-on process development, tool qualification, and close collaboration across functions.

Key Responsibilities

  • Develop and optimize etch processes for advanced packaging (TSV, plasma dicing, bonding)

  • Execute experiments, analyze data, and meet performance/yield/cost targets

  • Tool setup, qualification, matching, and troubleshooting

  • Drive process robustness using DOE, SPC, and Lean/Six Sigma tools

  • Work with equipment and integration teams on productivity and quality improvements

  • Support process ownership, reliability testing, and continuous improvement

  • Mentor junior engineers and ensure EHS compliance

Ideal Requirements

  • Bachelor's or higher in Engineering, Physics, or relevant field

  • Hands-on experience in TSV etch, plasma dicing, bonding etch

  • Strong data analysis, problem-solving, and cross-functional collaboration skills

  • Preferred: Master's or PhD in related field

  • Strong communication and interpersonal abilities, especially in cross-cultural settings

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.sg/refer-a-friend