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[OSAT] Yield & Process Integration Senior Engineer

Job description

Role Overview:

Responsible for driving process integration and yield improvement in wafer bumping operations. This role collaborates cross-functionally to resolve process issues, execute improvement initiatives, and support product transitions from NPI to mass production.

Key Responsibilities:

  • Troubleshoot bumping process (Dry & Wet) issues via DOE

  • Analyze yield data and detect trends

  • Lead continuous improvement and device qualification projects using APQP

  • Execute cost and yield improvement programs (CIP)

  • Optimize SPC limits to maintain process control

  • Handle customer spec reviews and technical inquiries

  • Coordinate BKM (Best Known Method) exercises initiated by customers

Ideal Requirements:

  • Degree in Engineering

  • 3+ years of experience in semiconductor process integration or yield engineering

  • Hands-on experience in bumping or front-end wafer fab processes

  • Skilled in data analysis, SPC, and APQP methodologies

  • Strong analytical, coordination, and problem-solving abilities

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.sg/refer-a-friend