[OSAT] Yield & Process Integration Senior Engineer

Role Overview:

Responsible for driving process integration and yield improvement in wafer bumping operations. This role collaborates cross-functionally to resolve process issues, execute improvement initiatives, and support product transitions from NPI to mass production.

Key Responsibilities:

• Troubleshoot bumping process (Dry & Wet) issues via DOE
  
• Analyze yield data and detect trends
  
• Lead continuous improvement and device qualification projects using APQP
  
• Execute cost and yield improvement programs (CIP)
  
• Optimize SPC limits to maintain process control
  
• Handle customer spec reviews and technical inquiries
  
• Coordinate BKM (Best Known Method) exercises initiated by customers
  

Ideal Requirements:

• Degree in Engineering
  
• 3+ years of experience in semiconductor process integration or yield engineering
  
• Hands-on experience in bumping or front-end wafer fab processes
  
• Skilled in data analysis, SPC, and APQP methodologies
  
• Strong analytical, coordination, and problem-solving abilities
  

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

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