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Process Engineer (DISCO Backgrinder, wafer saw, laser groove)

Job description

My clients, a leading provider of Test and Assembly services for a diverse range of Semiconductor Devices like Memory, mixed signal/RF and logic. They're looking for a Process Engineer to join their team in Singapore.

This incumbent is required to have experience in BG/LG/Saw process. Strong in DOE knowledge using JMP software for process optimization and characterization. This position is expected to follow-up on action plans to achieve the target yield at the final tape & reel.

Key responsibilities:

  • Have in-depth understanding of the assigned process, input parameters and output response to product yield, UPH, cost.
  • Have working knowledge of DISCO Backgrinder, wafer saw, laser groove, AOI inspection and Tape & Reel
  • Have working knowledge in analysing product yield impact.
  • Collaborate with internal and external customer to apply the best decision and solutions to meet customer expectations.

Key requirements:

  • Degree/Diploma in Electrical/Electronic Engineering or equivalent
  • Minimum 5 years' experience in a Semiconductor Backgriner, wafer saw & Tape & Reel environment.
  • Working knowledge in JMP analysis software
  • Good technical and analytical skills.
  • Able to work independently and with good initiative to overcome challenges.
  • Good management, leadership, and problem-solving skills.
  • Proficient in computer applications (Excel, Outlook, Word, PowerPoint).

If you believe you fit the requirements for the role, please click APPLY NOW or you can email your CV to jason.kukreja@ambition.com.sg

Data provided is for recruitment purposes only. Business License Number: 10C5117. EA Registration Number: R21103664. Regrettably, only shortlisted candidates will be notified.

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