Process Engineer - Plating & Wet Process

Join a leading semiconductor manufacturing environment driving advanced plating and wet process technologies.

Key Responsibilities

• Develop, optimize, and sustain electroplating processes such as Cu, Ni, and SnAg
• Support wet processes including etching, cleaning, stripping, and surface preparation
• Troubleshoot plating and wet process defects to improve yield and process stability
• Conduct DOE, process qualification, SPC monitoring, and root-cause analysis
• Perform laboratory analysis including chemical titration, CVS, TOC, and failure analysis
• Collaborate with Quality, Production, and R&D teams on process and product improvements
• Support equipment maintenance, process documentation, and EHS compliance

Requirements

• Degree in Chemical Engineering, Materials Engineering, Chemistry, or related field
• Experience in electroplating, semiconductor packaging, or wet chemical processes preferred
• Knowledge of plating chemistry, surface finishing, and wet process controls
• Familiarity with SPC, DOE, FMEA, and problem-solving methodologies
• Strong analytical, troubleshooting, and communication skills

Ideal for candidates passionate about semiconductor process engineering, chemical process optimization, and manufacturing excellence.