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Process Integration Engineer - Advanced Packaging (2.5D and 3D)

Job description

Role Overview:

Lead the development and integration of advanced 2.5D and 3D heterogeneous packaging technologies. This position focuses on aligning cross-functional teams to deliver next-generation semiconductor packaging solutions through technical leadership, process innovation, and project execution.

Key Responsibilities:

  • Drive integration of 2.5D/3D packaging technologies

  • Oversee process development: TSVs, interposers, die stacking

  • Manage projects, timelines, and budgets

  • Collaborate with R&D, design, and manufacturing teams

  • Identify and resolve technical integration challenges

  • Ensure quality control and compliance

  • Create technical documentation and reports

  • Mentor junior engineers and support knowledge transfer

Ideal Requirements:

  • Bachelor's/Master's in EE, Materials, or ME

  • 10+ years in semiconductor packaging; 5+ years in 2.5D/3D integration leadership

  • Expertise in TSV, interposer design, die stacking, SiP

  • Strong project and stakeholder management experience

  • Excellent problem-solving and communication skills

  • Proven leadership and cross-functional collaboration

  • Adaptable, quality-driven, and innovation-focused

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.sg/refer-a-friend