Process Integration Engineer - Advanced Packaging (2.5D and 3D)

Role Overview:

Lead the development and integration of advanced 2.5D and 3D heterogeneous packaging technologies. This position focuses on aligning cross-functional teams to deliver next-generation semiconductor packaging solutions through technical leadership, process innovation, and project execution.

Key Responsibilities:

• Drive integration of 2.5D/3D packaging technologies

• Oversee process development: TSVs, interposers, die stacking

• Manage projects, timelines, and budgets

• Collaborate with R&D, design, and manufacturing teams

• Identify and resolve technical integration challenges

• Ensure quality control and compliance

• Create technical documentation and reports

• Mentor junior engineers and support knowledge transfer

Ideal Requirements:

• Bachelor's/Master's in EE, Materials, or ME

• 10+ years in semiconductor packaging; 5+ years in 2.5D/3D integration leadership

• Expertise in TSV, interposer design, die stacking, SiP

• Strong project and stakeholder management experience

• Excellent problem-solving and communication skills

• Proven leadership and cross-functional collaboration

• Adaptable, quality-driven, and innovation-focused

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

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