[Semicon] Process Engineering Lead

Role Overview

Lead and drive the 12" wafer bumping engineering team, overseeing process development, optimization, and qualification. Provide strategic direction, ensure high yield and quality, and align technology roadmap with industry trends.

Key Responsibilities

• Provide leadership and strategy for bumping engineering team

• Develop, optimize, and qualify 12" bumping processes

• Define and execute technology roadmap for bumping

• Collaborate with manufacturing, quality, equipment, and R&D teams

• Manage resources, including team, equipment, and budget

• Drive innovation, continuous improvement, and risk mitigation

Ideal Requirements

• Bachelor's/Master's in Engineering, Physics, Materials Science, or related field

• 10-12 years' experience in bumping engineering or related field with strong 12" wafer expertise

• Proven leadership with team management and strategic initiative success

• Strong technical knowledge in bumping process development, integration, and optimization

• Excellent communication and cross-functional collaboration skills

• Strong analytical and problem-solving abilities

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614