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[Semiconductor Packaging] Process Manager

Job description

Role Overview:
Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence.

Key Responsibilities:

  • Provide leadership and strategic direction for the bumping engineering team

  • Oversee development, optimization, and qualification of 300mm bumping processes

  • Execute technology roadmap and stay ahead of industry trends

  • Collaborate with manufacturing, quality, equipment engineering, and R&D teams

  • Manage personnel, equipment, and budget to meet departmental goals

  • Foster innovation and continuous process improvement

  • Identify and mitigate process risks to ensure production quality

Ideal Requirements:

  • Bachelor's in Engineering, Physics, Materials Science, or related field

  • 10-12+ years experience in bumping engineering or 300mm wafer processing

If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614

If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply. https://www.ambition.com.sg/refer-a-friend