2026 Market Insights & Salary Guide
Explore the latest hiring trends and in-demand skills shaping the employment landscape in 2026 to guide your hiring strategies or job search.
Explore the latest hiring trends and in-demand skills shaping the employment landscape in 2026 to guide your hiring strategies or job search.
Explore the latest hiring trends and in-demand skills shaping the employment landscape in 2026 to guide your hiring strategies or job search.
Explore the latest hiring trends and in-demand skills shaping the employment landscape in 2026 to guide your hiring strategies or job search.
Job Description:
* Lead the Equipment Section to maintain high team morale and deliver strong KPIs and sustainable long-term performance.
* Ensure compliance with MRB, TECN, 8D, specifications, and QMS tools (SPC, FMEA) to enable timely issue detection and effective resolution.
* Drive risk management and continuous improvement initiatives to prevent quality, yield, and excursion issues. * Define targets and lead improvement projects to reduce wafer scrap, defects, and rework, while improving process capability.
* Track and ensure project execution aligns with fab performance and operational requirements.
* Forecast and manage equipment repair and management budgets while driving cost optimization initiatives. * Collaborate with Process and Manufacturing teams to resolve equipment constraints, improve OEE, and optimize metrology sampling.
* Manage vendor performance to enhance quality, cost efficiency, and service support.
* Ensure full compliance with EHS standards and maintain high housekeeping practices.
* Oversee spare parts inventory control and forecast usage to ensure availability and cost efficiency.
* Set clear performance expectations, conduct regular reviews, and support team capability development and career progression.
* Ensure effective training, competency development, and proper documentation of technical knowledge
. Requirements:
* Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
* 8 years of relevant work experience in Thin Film CMP Equipment.
* Min 5 years of proven track record in a managerial role with strong leadership capabilities.
* An excellent team player with good interpersonal, communication and written skills
* High level of integrity with strong leadership attributes to lead and coach a team
* Highly committed with good ownership and accountability
* Able to adapt in a fast-paced environment and work under pressure
* Proficient in MS Office Applications and good data analytical skill.